• Semiconductor die to package substrates
• Semiconductor packages to Printed Circuit Boards (PCBs)
• Layers within package substrates and PCBs
• PCBs to PCBs

µPILR™ Package Stacking
µPILR technology uses low-profile, pin-shaped contacts to replace the solder balls used in chip-scale, multi-chip, and package-on-packages today. Key benefits provided by µPILR contacts include: finer pitch, lower profile, improved performance and higher reliability, which are critical enablers for greater levels of functionality in ultra miniaturized form factors. µPILR pins are up to 50% smaller in diameter and up to 50% smaller in height over solder balls. The reduced form factor provides significant benefits in many packaging applications including:

• Logic + Memory Stacking
• NAND Flash Stacking
• High Density DRAM Stacking
• Mobile Memory (e.g. Flash/SRAM)

Technology Features & Benefits:

• Very low profile package
• Very fine pitch
• Enhanced Reliability
• Packages individually testable before stacking
• Highly coplanar contact array (contacts are typically nickel/gold plated copper)
• Conventional materials and assembly processes used for manufacturing
• Increased functionality within the same package footprint
• Short connections for high performance
• High density routing between contacts

Advanced µPILR™ technology enables dramatic improvements in profile, pitch, performance, and reliability over existing interconnect technologies.

For more information about the company's portfolio of image enhancement technologies, please info@tessera.com.